Repair & Rework of Electronic Assemblies

• Repair and rework including disassembly, removal of coatings, de-soldering, hand-placing with the correct component value(s), soldering, re-coating, and testing
• Fine-pitch quad flat packs, and other chip-scale packages
• Including ball grid arrays (BGAs) BGAs are subjected to X-ray inspection to verify proper placement
• Higher volume production assemblies that need part replacements possible